Benchmark Electronics, Inc.
New York Stock ExchangeCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- David Moezidis
- Full Time Employees
- 11,700
- Sector
- Technology
- Industry
- Hardware, Equipment & Parts
- Address
- 56 South Rockford Drive Tempe AZ United States of America 85281
- IPO Date
- Jun 27, 1990
- CIK
- 0000863436
- Website
- bench.com
- Similar Companies
- Business
- Benchmark Electronics, Inc. Benchmark Electronics, Inc. (NYSE: BHE) provides engineering, design, automation, test development, prototyping, and advanced manufacturing services for original equipment manufacturers across complex industrials, aerospace and defense (A&D), medical, semiconductor capital equipment (Semi-Cap), advanced computing, and next-generation communications sectors; core offerings include product design, printed circuit board (PCB) layout and assembly, precision machining, full-system electronic assembly, electron-beam welding, sheet metal fabrication, photonics test and packaging, high-speed RF system design up to 110 GHz, medical robotics and imaging systems, fluid management devices, configure-to-order solutions, and lifecycle management from research and development through volume production and aftermarket support. Headquartered in Tempe, Arizona, the company was founded in 1979 and operates approximately 24 facilities with over 12,000 employees across the U.S., Singapore, other parts of Asia, Europe including Romania and the Netherlands, Mexico, and additional countries, serving customers in telecommunications equipment, industrial control, testing and instrumentation, computers, and medical devices. In recent developments, Benchmark Electronics more than doubled its manufacturing capacity with a major expansion of its Brasov, Romania facility in 2024 adding 500 jobs to support European regionalization; broke ground on its fifth facility in Penang, Malaysia in early 2025 with USD25 million investment for 215,000 square feet focused on wafer fab equipment including cleanrooms, complex machining, and powder coating to exceed 720,000 square feet total in Penang; opened a new 321,000-square-foot advanced manufacturing plant in Guadalajara, Mexico in mid-2025 representing a 50% regional footprint increase for medical, industrial, computing, and communications products; and deepened capabilities through partnerships such as with Oxide Computer Company for cloud computing hardware featuring large ASICs and high-speed systems.
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